COMe-cTH6
CPUボード / COM Express
COM Express® Compact Pin-Out Type 6 With AMD™ Embedded R-Series APU ・AMD embedded R-Series Advanced Processing Unit (APU) ・integrated Radeon™ HD 7000 Series GPU ・Superior graphics support & Multi-Monitor use up to 4 displays ・Support for Direct X® 11, OpenCL™ 1.1 and OpenGL® 4.2
COMe Ref.Carrier–i T6 TMI
評価用ボード / COM Express
COM Express® Reference Carrier Type 6 For Industrial Temperature ・COM Express® Rev. 2.1, Pin-out Type 6 ・mini-ITX Form Factor (170mm x 170mm) ・Comprehensive connectivity ・Industrial temperature grade
COMe-bIP#
CPUボード / COM Express
COM Express® Basic Type 2 & 6 With 3rd Generation Intel® Core™ Processors ・Intel® 3rd Generation Core™ i7/i5/i3/Celeron Series with QM77/HM76 PCH ・COMe-bIP2 and COMe-bIP6 with non-ECC DDR3 up to 16GB ・COMe-bIP6RXT with ECC DDR3, Rapid Shutdown, Industrial Temperature Grade ・Triple Independent Display support
bCOM6-L1700 Rugged COM Express Module – Based on AMD® R-series APU processing technology
CPUボード / COM Express
Form Factor : COM Express Basic, Type 6 Processor : 2nd Gen. AMD R-Series APU Maximum Memory : Up to 16 GB DDR3 SDRAM with ECC I/O : Audio, DDI, Gigabit Ethernet, GPIO, SATA, USB, VGA Application : Rugged, Video & Graphics Cooling : Air, Conduction Conformal Coating : Option
COMe-cOH#
CPUボード / COM Express
COM Express® Compact Type 2 & 6 With AMD™ Embedded G-Series APU ・AMD™ embedded G-Series Advanced Processing Unit (APU) ・AMD A55E/A50M Fusion Controler Hub (FCH) ・Excellent integrated graphics support & Multi-Monitor use ・Support for Direct X® 11, OpenCL™ 1.0 and OpenGL® 3.2