COMe-bHL6
CPUボード / COM Express
COM Express® Basic Type 6 With 4th Generation Intel® Core™ Processors ・Intel® 4th Generation Core™ i7/i5/i3/Celeron Series with QM87/HM86 PCH ・COMe-bHL6 with non-ECC DDR3L up to 16GB ・COMe-bHL6XT with ECC DDR3L, Industrial Temperature Grade ・Triple Independent Diplay support with Daisy-Chaining and 4k resolutions
bCOM6-L1800 Rugged COM Express Module – Based on Intel Skylake processing Technology
CPUボード / COM Express
Form Factor : COM Express Basic, Type 6 Processor : Intel Core i7 Maximum Memory : 32 GB DDR4 SDRAM soldered with ECC I/O : Audio, DDI, Gigabit Ethernet, GPIO, SATA, USB, VGA Application : Rugged, Video & Graphics Cooling : Air, Conduction Conformal Coating : Option
COMe-cTH6
CPUボード / COM Express
COM Express® Compact Pin-Out Type 6 With AMD™ Embedded R-Series APU ・AMD embedded R-Series Advanced Processing Unit (APU) ・integrated Radeon™ HD 7000 Series GPU ・Superior graphics support & Multi-Monitor use up to 4 displays ・Support for Direct X® 11, OpenCL™ 1.1 and OpenGL® 4.2
COMe Ref.Carrier–i T6 TMI
評価用ボード / COM Express
COM Express® Reference Carrier Type 6 For Industrial Temperature ・COM Express® Rev. 2.1, Pin-out Type 6 ・mini-ITX Form Factor (170mm x 170mm) ・Comprehensive connectivity ・Industrial temperature grade
COMe-bIP#
CPUボード / COM Express
COM Express® Basic Type 2 & 6 With 3rd Generation Intel® Core™ Processors ・Intel® 3rd Generation Core™ i7/i5/i3/Celeron Series with QM77/HM76 PCH ・COMe-bIP2 and COMe-bIP6 with non-ECC DDR3 up to 16GB ・COMe-bIP6RXT with ECC DDR3, Rapid Shutdown, Industrial Temperature Grade ・Triple Independent Display support
bCOM6-L1700 Rugged COM Express Module – Based on AMD® R-series APU processing technology
CPUボード / COM Express
Form Factor : COM Express Basic, Type 6 Processor : 2nd Gen. AMD R-Series APU Maximum Memory : Up to 16 GB DDR3 SDRAM with ECC I/O : Audio, DDI, Gigabit Ethernet, GPIO, SATA, USB, VGA Application : Rugged, Video & Graphics Cooling : Air, Conduction Conformal Coating : Option
COMe-cOH#
CPUボード / COM Express
COM Express® Compact Type 2 & 6 With AMD™ Embedded G-Series APU ・AMD™ embedded G-Series Advanced Processing Unit (APU) ・AMD A55E/A50M Fusion Controler Hub (FCH) ・Excellent integrated graphics support & Multi-Monitor use ・Support for Direct X® 11, OpenCL™ 1.0 and OpenGL® 3.2
COMe Ref.Carrier-i T10 TNI
評価用ボード / COM Express
COM Express® Reference Carrier Type 10 For Industrial Temperature ・COM Express® Rev. 2.1, Pin-out Type 10 ・nano-ITX Form Factor (120mm x 120mm) ・Comprehensive connectivity ・Industrial temperature grade
COMe-bSC#
CPUボード / COM Express
COM Express® Basic Type 2 & 6 With 2nd Generation Intel® Core™ Processors ・Intel® 2nd Generation Core™ i7/i5/i3/Celeron Series with QM67/HM65 PCH ・COMe-bSC2 and COMe-bSC6 with ECC or non-ECC DDR3 up to 16GB ・COMe-bSC2RXT with Rapid Shutdown, Industrial Temperature Grade ・New DDI graphic interfaces and USB 3.0
mCOM10-L1500 Rugged COM Express Module – Type 10 ‘Mini’ module
CPUボード / COM Express
Form Factor : COM Express mini, Type 10 Processor : AMD Embedded G-Series SOC Maximum Memory : Up to 8 GB DDR3 SDRAM Ethernet : Gigabit Ethernet Conformal Coating : Option Operating System (OS) Support : Linux, VxWorks, Windows Memory : Up to 8GB DDR3 Operating Temp : 0°C to +65°C