11U Shipborne RF Chassis
筐体 / その他の規格
・Description: Shipboard RF Solution. Shipborne chassis with RF blind mate through backplane. IEEE 1101.10 mechanical packaging with 6U x 220MM card cage. RF coax contacts feed through the backplane. Integrated with RF semi-flex coax cables. ・Size: 19" Rackmount x 11U high x 24" deep ・Slot Count: 20 Slots 0.8" Pitch ・Cooling: Air cooled chassis and …
Parvus DuraCOR 80-40
筐体 / PCIe104
・High Performance CPU: Intel 2nd Generation Core i7 (Sandy Bridge) Processor, 2.2 GHz , Dual-Core, 8 GB DRAM with Integrated GPU and Advanced Vector Extensions (AVX) Signal Processing ・Connectivity & I/O ・2x Gigabit Ethernet 10/100/1000 Mbps LAN Interfaces ・6x USB 2.0, 2x RS-232 Serial, 16x Discrete DIO ・Dual Video Output (VGA, HDMI), Stereo …
Basic Subracks
筐体 / VMEbus
・Rackmount or optional mount configurations ・Available with VME64x, cPCI, VPX, or hybrid backplanes ・Card cages from 3U to 9U in size ・Subracks from 1-21 slots
2U Internet Security
筐体 / VMEbus
・Description: 2U Internet Security Chassis ・Size: 19" Rackmount x 2U high x 14.84" deep ・Slot Count: 4 Slots 0.8" Pitch ・Supported Bus Structures: VME, VME64x, CompactPCI ・Cooling: Air cooled boards & enclosure ・Power Supply: Hot Swappable Power Supplies
3U 4-slot MPMC-9341
筐体 / OpenVPX
・Form Factor ・3U VPX ・Four system slots ・Mechanical ・Dimensions: 13.66” x 6.09” x 8” or 13.66" x 6.05" x 8.02" ・Weight: 28-30.5 lbs (fully populated) ・Power Supply ・28 VDC input ・MIL-STD-704E ・Backplane Fabric ・PCIe between system slots ・Environmental ・Designed to meet MIL-STD-810 ・EMI ・Designed to meet MIL-STD-461 ・Power ・Desig…
3/4 ATR Forced Air Conduction Chassis
筐体 / OpenVPX
・Description: Forced air conduction cooled chassis. Rugged environments for airborne and ground mobile applications. Extended temperature, shock and vibration tolerance. ・Size: 3/4 ATR Short (7.50" w x 12.52" d x 7.62" h) ・Cooling: Conduction-to-Air heat exchanger. 3U Payload conduction cooled boards ・Slot Count: (5) 3U 1.0" pitch VPX-REDI slots or…
3U 1-slot MPMC-9310
筐体 / PMC/XMC
・3U cPCI Backplane ・Volume optimized - single slot chassis - 3.71" x 4.89" x 7.80" ・Under 5 lbs. fully populated ・28 VDC input @ up to 55W
PRME 1U Enclosures
筐体 / CompactPCI
・Description: PRME 1U superior cooling for a low profile design solution. ・Size: 1U 19" rackmount chassis ・Cooling: Advanced cooling design with patented CoolSlot® air deflecting card guides, optimize airflow, high performance 40mm fans, side-to-side/rear airflow path and cooling of both front cards and rear transition cards. Air cooled boards & ch…
ATR OpenVPX Heat Exchanger
筐体 / OpenVPX
・Description: ATR Airborne Liquid/Air Cooled Heat Exchanger Solution ・Cooling: Liquid Cooled with Liquid-Air Heat Exchanger. Air Cooled chassis and boards. Liquid Cooled Enclosure. Mixed Technology Solutions. ・Power Supply: Liquid Cooled ・Supported Bus Structure: OpenVPX ・Chassis Type: ATR
VIPC8244
筐体 /
・1 + 8 MB FLASH memory ・Fast Ethernet interface and Ultra SCSI interface ・64 MB SDRAM ・MPC8240 CPU