6U 4-slot VME64x-VXS Backplane
筐体 / VMEbus
・Description: Custom hybrid VME64x/VXS Backplane ・Slot Count: 1 VXS switch, 2 VXS payload, and 1 VME64x ・Supported Bus Structures: VXS (VITA 41), VME64x ・Size: 6U
Air Blockers
筐体 / OpenVPX
・Full range of sizes from 3U x160 mm and 6U x 160 mm to 9U x 400 mm Compatible with VME, VXI, VME64x, OpenVPX and CompactPCI (cPCI) ・Silver-filled elastomeric EMI gaskets eliminate problems associated with competitive metal gaskets (i.e. no sharp edges, no snags) ・Air dams may be located on the upper or lower edges, blocking the airflow in and out …
Front Panels/Faceplates
筐体 / OpenVPX
・Elastomeric EMI gaskets eliminate problems found in competitive metal gaskets (no sharp edges, no snags) ・Offered in various widths and heights ・1” VITA 48.1 REDI compliant versions also available ・An assortment of handles is available
RME 9/13U Conduction-cooled Enclosures
筐体 / OpenVPX
・Description: RME Enclosure ・Cooling: Air-cooled chassis and conduction-coooled boards ・Size: 9U/13U 19" Rackmount Enclosure ・Slot Count: 12-slots/16-slot ・Supported Bus Structures: VPX, OpenVPX, VPX-REDI (VITA 46/48/65/68)
3U 4-slot MPMC-9341
筐体 / CompactPCI
・Form Factor ・3U VPX ・Four system slots ・Mechanical ・Dimensions: 13.66” x 6.09” x 8” or 13.66" x 6.05" x 8.02" ・Weight: 28-30.5 lbs (fully populated) ・Power Supply ・28 VDC input ・MIL-STD-704E ・Backplane Fabric ・PCIe between system slots ・Environmental ・Designed to meet MIL-STD-810 ・EMI ・Designed to meet MIL-STD-461 ・Power ・Desig…
HPEC Development Platform
筐体 / OpenVPX
・Continuum HPEC Software Platform Features ・Processor abstraction (Intel®, Power Architecture™, FPGA and GPGPU) ・DMA control and fabric handshake ・Zero-Copy data transfers ・Middleware/user layer abstraction (OpenMPI and other OS function calls) ・Supports DMA controlled diagnostics utilities and tools ・Low latency high speed (up to 20Gbi…
3/4 ATR Forced Air Conduction Chassis
筐体 / OpenVPX
・Description: Forced air conduction cooled chassis. Rugged environments for airborne and ground mobile applications. Extended temperature, shock and vibration tolerance. ・Size: 3/4 ATR Short (7.50" w x 12.52" d x 7.62" h) ・Cooling: Conduction-to-Air heat exchanger. 3U Payload conduction cooled boards ・Slot Count: (5) 3U 1.0" pitch VPX-REDI slots or…
VIPC8241
筐体 /
・Fast Ethernet interface ・4 IndustryPack slots with front panel I/O ・32 MB SDRAM ・MPC8240 CPU
CP-630
筐体 / PMC/XMC
・Industry-standard IBM 64-bit, 133 MHz PCI-X bridge chip ・Front or back panel I/O support for both PMC sites ・Two PMC slots on a 6U Compact PCI card
SPR418A
筐体 / PMC/XMC
・Adapts one PMC or XMC card to x8 PCI Express ・Supports Gen2 PCI Express ・PMC site supports PCI-X 133 MHz ・Optional connectors provide J4 and J16 connectivity as well as standalone operation ・Integrated fan ・Delivers up to 25W to mezzanine site