3U 5-slot MPMC-935x
筐体 / OpenVPX
・Processing ・Intel® Core™ Duo/i7 or Freescale Power Architecture™ MPC7448/8640 ・Optional Interfaces ・MIL-STD-1553 - Up to two dual redundant channels ・ARINC 429 - Up to 32 channels ・Individually selectable as RX or TX ・Video up to 4 outputs ・DVI, LVDS or VGA ・Optional PowerPC video processor ・Video input, up to 6 channels ・(NTSC, PAL…
1 ATR Short Rugged Enclosure
筐体 / OpenVPX
・1 ATR Short form factor per ARINC 404A ・6U 7-slot open bus architecture or custom backplane (CompactPCI, VME, OpenVPX or custom) ・Cooled via forced convection. Air flows down sidewalls from rear to front with 2 fans mounted at the rear. ・Chassis can maintain an 85°C card edge temperature ・At 55°C up to 328W ・At 25°C up to 656W ・Chassis mounts …
CHAMP-AV9 6U OpenVPX
CPUボード / OpenVPX
・Extreme numerical processing for DSP and general purpose applications ・Reduces size, weight, and power 2-4X over previous generations ・Seamless integration into HPEC systems including FPGA’s, GPGPU’s, Sensor I/O and Middleware ・6U OpenVPX compliant ・Two Intel Core-i7 quad-core 4th generation processors ・614-1318 GFLOPs peak computing performance ・…
3U 3-slot MPMC-9335
筐体 / OpenVPX
・Form Factor ・3U VPX backplane ・Mechanical ・baseplate cooling ・Volume optimized ・9.3” x 5.5” x 4.9” (LWH) ・14.5 lbs (fully populated) ・Standard Configuration ・(1) VPX3-1256 3U OpenVPX SBC ・Intel® Core™i7 Quad Core ・8 GB DDR ・8 GB Flash SSD ・(1) VPX3-491 3U OpenVPX GPU Digital Signal Processor ・NVIDIA® Fermi GPGPU ・240 c…
ATR OpenVPX Heat Exchanger
筐体 / OpenVPX
・Description: ATR Airborne Liquid/Air Cooled Heat Exchanger Solution ・Cooling: Liquid Cooled with Liquid-Air Heat Exchanger. Air Cooled chassis and boards. Liquid Cooled Enclosure. Mixed Technology Solutions. ・Power Supply: Liquid Cooled ・Supported Bus Structure: OpenVPX ・Chassis Type: ATR
ACR5305 3U VPX Carrier Card
筐体 / OpenVPX
・3U VPX Carrier Card ・Compatible with VITA 65 module/slot profiles: ・MOD3-PER-2F-16.3.1-3 / SLT3-PER-2F-14.3.1 ・MOD3-PER-1F-16.3.2-2 / SLT3-PER-1F-14.3.2 ・MOD3-PAY-1D-16.2.6-1 / SLT3-PAY-1D-14.2.6 ・MOD3-PAY-2F-16.2.7-1 / SLT3-PAY-2F-14.2.7 ・The board is compatible with payload profiles but has no hosting capabilities ・Available in conduct…
SBC324
CPUボード / OpenVPX
・3U OpenVPX SBC ・Intel 2nd Generation Core i7 processor @ up to 2.5 GHz ・Mobile Intel QM67 Express Chipset ・Up to 8 GB of DDR3 SDRAM w/ECC ・Up to 32 GB NAND Flash ・On-board XMC with IO expansion site ・Air and Conduction cooled versions ・Comprehensive Deployed Test Software ・Comprehensive OS support
6U High Power Rack Chassis
筐体 / OpenVPX
Description: High Power Solution Top Load Chassis for airborne signal processing applications at up to 20,000 ft altitude Size: 19" Rackmount x 6U x 22.5" deep Slot Count: 8 Slots Cooling: Provides 30 CFM/slot air flow with high pressure drop payload. Air cooled boards and chassis. Supported Bus Structures: VXS (VITA 41) Power Supply: 1100W of powe…
OpenVPX NVIDIA Fermi GPGPU 6U Quick Start Kit
GPGPU / OpenVPX
・VPX6-1956 Intel 2nd Generation Core i7 SBC ・2.1 GHz quad-core i7 CPU with AVX ・16 GB DDR3 ・32 GB SSD ・VPX6-490 Dual NVIDIA® Fermi™ GP-GPU board ・Dual 240-core Fermi class GPUs ・2 GB of GDDR5 per GPU ・6-slot 6U 1” pitch OpenVPX™ Desktop Chassis ・5-slot full mesh, one uncommitted slot ・1900 W power supply, 110V/220V input ・Backplane wi…
CHAMP-WB-DRFM Digital RF Memory Card Set
ストレージ / OpenVPX
・OpenVPX™ (VITA 65) profile MOD6-PAY-4F-10..3.1-x; MOD6-PER-1Q-10.3.5-2, VPX REDI (VITA 48 option) ・Single user-programmable Xilinx Virtex-7 FPGAs (X690T), with ・8 GB DDR3L SDRAM in two banks ・Four 4-lane serial data plane links to the backplane (support up to 10.3 Gbps data rates) ・Gen2 SRIO, Aurora or alternate fabrics with different FPGA …