XtraPower PPCM2
CPUボード / VMEbus
・Five ruggedization levels, air- and conduction-cooled ・6U VME SBC ・Two independent processor nodes ・2x Freescale Power Architecture 7448 @ 1.4 GHz ・2x PMC slots ・For Ruggedization Levels, please see the configuration guide under the downloads tab ・P0P2X600 Rear Transition Module
VR7
CPUボード / VMEbus
・Fast Ethernet 10/100BaseT ・Extended temperature, optional conduction cooled ・Intel Pentium III and Celeron Processor up to 850 MHz ・Optional MIL-STD-1553
RDS10
筐体 /
・For Ruggedization Levels, please see the configuration guide under the downloads tab ・Front panel on/off and reset switches ・Removable front access door ・Country-independent auto-ranging PSU ・Accepts standard GE Intelligent Platforms I/O kits and panels ・Small, easily managed form factors ・Internal layout optimized for rear I/O boards
CM4R
CPUボード / CompactPCI
・Conformal coating and Shock/Vibration immunity ・Eight bits of discrete TTL I/O w/Interrupt capability ・Up to 256 MB SDRAM with ECC (100 MHz) ・Motorola Power Architecture 7410 at 500 MHz.
CPCI-200A-BP
筐体 / CompactPCI
・Four IndustryPack slots on a 6U CPCI card ・8 MHz IndustryPack clock for each slot ・Front or back I/O (order option)
CPCI-200B-BP
筐体 / CompactPCI
・Front or back I/O (order option) ・Four IndustryPack slots on a 6U CPCI card ・8 MHz IndustryPack clock for each slot
XMCF01
ストレージ / PMC/XMC
・Up to 256 GB total onboard storage capacity ・Air cooled (Levels 1-3) and Conduction Cooled (Levels 4-5) options ・Single-level Cell [SLC] Flash Technology ・High Performance - Sequential Read 180 MB/Sec @ 128 kb blocks - Sequential Write 114 MB/Sec @ 128 kb blocks ・AES-128 Encryption ・Military Purge Algorithms ・Hardware Write Protection ・Wear Leveli…
1553-PMC3
通信I/O / PMC/XMC
・Up to 8 differential discrete signals (RS422) ・Weight for 1555-PMC3-4FN00: 3.02 oz ・Up to 32 single ended discrete signals (TTL) ・Support for 3.3 V PMC ・PCI 33/66 MHz up to 266 MB/s
IMP20 Image Processing Module
グラフィック / その他の規格
・Real-time, full-frame, multi-resolution image fusion ・Intelligently combines input from multiple imagers ・Outperforms software-based solutions ・Rugged Real-Time Image Processing Module