・One user-programmable Xilinx® Virtex-5 FPGA Node (SX50T or SX95T) with:
・One bank of DDR2 SDRAM per FPGA node (256 MB total), up to 2.2 GBytes/sec of bidirectional bandwidth
・Two banks of QDR-II+ SRAM per FPGA node (18 MB total), up to 4.4 GBytes/sec of bidirectional bandwidth
・Three high-speed serial ports with up to 7.5 GBytes/sec of bi-directional bandwidth. ・Two are configurable offering front panel, rear panel, or baseboard connectivity
・40 pairs (80 pins) of discrete LVDS or LVTTL signals from the FPGA to the front panel personality connector
・24 pairs (48 pins) of discrete LVDS or LVTTL signals from the FPGA to the base board connectors
・Thermal sensors for monitoring board temperatures
・Sensors for monitoring FPGA power consumption
・Support for ChipScope Pro and JTAG processor debug interfaces
・Continuum FXtools FPGA design kit with highly-optimized VHDL libraries, development environment, reference designs, scriptable SystemVerilog-based simulation test bench, and software libraries
・Continuum IPC - interprocessor communications middleware available
・XMC form factor, 4-lane PCI Express, with auxiliary Pn4 and Pn6 connectors
・Range of air and conduction-cooled ruggedization levels available
・One bank of DDR2 SDRAM per FPGA node (256 MB total), up to 2.2 GBytes/sec of bidirectional bandwidth
・Two banks of QDR-II+ SRAM per FPGA node (18 MB total), up to 4.4 GBytes/sec of bidirectional bandwidth
・Three high-speed serial ports with up to 7.5 GBytes/sec of bi-directional bandwidth. ・Two are configurable offering front panel, rear panel, or baseboard connectivity
・40 pairs (80 pins) of discrete LVDS or LVTTL signals from the FPGA to the front panel personality connector
・24 pairs (48 pins) of discrete LVDS or LVTTL signals from the FPGA to the base board connectors
・Thermal sensors for monitoring board temperatures
・Sensors for monitoring FPGA power consumption
・Support for ChipScope Pro and JTAG processor debug interfaces
・Continuum FXtools FPGA design kit with highly-optimized VHDL libraries, development environment, reference designs, scriptable SystemVerilog-based simulation test bench, and software libraries
・Continuum IPC - interprocessor communications middleware available
・XMC form factor, 4-lane PCI Express, with auxiliary Pn4 and Pn6 connectors
・Range of air and conduction-cooled ruggedization levels available
